Aixtron recently teamed up with the Fraunhofer Institute for Integrated Systems and Device Technology (IISB) in Germany, to develop 150-mm silicon carbide (SiC) epitaxy processes using Aixtron’s G5WW vapor-phase epitaxy system. Aixtron plans to install its system at the IISB cleanroom in Q4 2014....
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Research Brief | April 19, 2022
The ongoing chip shortage has impacted many companies that depend on computer chips, from automotive to consumer electronics to companies developing IoT (Internet of Things) products in the spirit of digital transformation. Now, with the ongoing Russia–Ukraine war, the same companies are on the edge... Not part of subscription
Company Profile | April 21, 2022
Founded in 2009 by Dr. Ian Redmond to commercialize his work on photopolymer HOEs; initially incorporated as Ceres Imaging and rebranded to Ceres Holographics in 2015 Uses proprietary design software, algorithms, and a holographic printer to create a master HOE film that is used to produce ... To read more, click here.
Company Profile | May 24, 2022
Founded by Yu Kambe and Dmitri Talapin in 2019, based on research done at the University of Chicago and Argonne National Laboratory Develops photocleavable ligands for QDs and their use in QD color converter applications Claims to achieve 2‑µm patterning resolution while preserving nearly 100... To read more, click here.