Thermal Management Materials Innovation Landscape

August 23, 2019 | Research Report

All types of electronic devices will need improved thermal management materials and systems. As chips improve their performance and more devices are packed into smaller areas, heat fluxes will increase, which will pose major cooling challenges. This report provides a landscape of material innovations, an overview of key players in the field, and our thoughts on future opportunities in thermal management materials.

Services

  • Chemicals
  • Government & Non-Profit
  • Industrials

Table of Contents

  • Title page
  • Introduction
  • Taxonomy
  • Materials innovation
  • Analysis
  • Outlook

Lead Analyst

Research Director

Contributors

Jerrold Wang, MBA
Related companies Showa Denko, 3M, Saint-Gobain, XG Sciences, Graftech, Angstron Materials, Laird Technologies, Carbodeon, Denka, BNNT, AzTrong, GNext, American Boronite, NanoXplore, BNNano, Versarien, Nitronix, Graphnena

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